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Date:2018-08-28

Title:电子封装、微机械与微系统

Publisher:西安电子科技大学出版社

Project Source:国家“十二五”规 划教材

First Author:田文超

Type of Works:Teaching material

Discipline:Engineering

ISBN No.:978-7-5606-2700-7

Translated or Not:No

Date of Publication:2012-01-01