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Date:2018-08-28

Title:电子封装结构设计

Publisher:西安电子科技大学出版社

Project Source:西安电子科技大学教材和研究生精品立项教材资助

First Author:田文超，刘焕玲，张大兴

Type of Works:Teaching material

Discipline:Engineering

ISBN No.:9787560642369

Translated or Not:No

Date of Publication:2017-04-01